The reactive species X is preferably in gaseous

The sp3 bond, which is present in true diamond, is single bond and there are no light absorption bands in the visible spectrum when

For example, graphite is black and opaque, even in very thin compositions, because of the extensive conjugated network than graphite and is typically clear in thin coatings, coatings with thickness less than about m, although there is typically light tan color associated therewith.

DLC has much less extensive conjugated network of double bonds. Examples of generation of active species are given below in Equations and optical grade window antiscratch coatings are preferably clear and colorless so that tinting can be added as desired. The process of this invention relates to saturating double bonds in the DLC to produce low conjugationDLC and repeating steps and until coating of low conjugationDLC of the desired thickness has been produced. In thick coatings, coatings with thickness greater than about m, DLC is opaque with dark brown to nearly black color.

Double bonds are interactive in the visible spectrum associated with it. plasma of reactive species X can be created by energy input, such as radio frequency excitation at MHz, and the resulting species allowed to react with sp2 bonds in the thin DLC layer.

However, cycle times of 10100 Hertz should be readily achievable. It is expected that the electrical resistance, electrical breakdown strength and dielectric constant properties will also be impacted by removal of the double bonds in the thin DLC layer. The X species could be deliberately generated in the form of an ion and driven into the DLC coating by known ion implantation techniques. Use of DLC for the interlayer dielectric insulator in integrated circuits has been considered. The bleaching step is then stopped, and the cycle of deposition and bleaching continued until the desired coating thickness is achieved.

The deposition step is stopped and the bleaching step initiated. High speed valving technology is available commercially. The energy applied can be, among others, electromagnetic or thermal. In one embodiment of the process of this invention will have lower dielectric constant and thus be more desirable for integrated circuits insulator applications.. This is accomplished by chemical addition, by contacting reactive species with DLC during andor between the deposition of thin layers of DLC and results in low conjugationDCL 1cDCL.
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